Manufacturing of automation components with high technology systems

Abstract

With the development of smaller technologies, semiconductor layer depositions are used in several demanding applications such as integrated circuits, transistors, diodes and RF appliances used in very high-speed devices, and metal layer depositions are used in the manufacture of different kinds of transportation, jewelry and contacts and also in construction, household items and consumer electronic. The simulation with a Monte Carlo code has been applied in order to calculate the energy and the number of sputtered particles arriving at the substrate, which are both important parameters influencing the microstructure of the deposited thin film layers. the pressure and the distance between target and substrate are the two very important factors to modify the microstructure or crystallographic orientation of the deposited metal or semiconductor layers highly used in this ever-changing world and development processesAutomated systems, however, do have certain limitations and drawbacks. Although usually very reliable, they can malfunction. Moreover, an entire system may fail to operate properly if there is a single error in setting it up. A backup system has to be provided or a human “override” capability built into the system so that operations can be handled manually. Automated systems also lack the flexibility of humans. Any significant change in their function may thus require extensive redesigning of the equipment. This problem has been mitigated by the use of computer programs that can be modified with relative ease, but action, sensing, and control components still have to be tailored to specific applications. This is one reason that large amounts of money are required as a company or industry becomes increasingly more automated. In the long term, automation generally yields economic benefits. An exception would be a situation where an operation has to be automated for technical or safety reasons only